Invisible Connections at BAU 2023
Invisible Connections showcased their range of innovative telescopic connectors at BAU 2023, 17-22 April 2023 in Munich.
This flagship event in the construction calendar brings together the international community for planning, building and designing buildings – and we were delighted to be part of the BAU 2023 experience!
The world’s leading trade fair for architecture, materials and systems
Improving cost efficiencies, health and safety and more sustainable construction
Members of the Invisible Connections team from both the UK and Norway attended the event. On the iC stand, product demonstrations showed how telescopic connectors provide a hidden means of support for beams, columns and stair landings; providing a simpler, more cost-effective and aesthetic alternative to traditional concrete connection methods. Attendees were also interested in hearing how FERBOX bespoke reinforcement continuity system satisfies design requirements, saves costly wastage and mitigates health and safety risks.
Latest generation of telescopic connectors means less concrete and less CO2
The event provided the perfect platform to showcase Invisible Connections’ latest generation of telescopic connectors: the TSS and RVK 60P. The new ‘slim design’ 60P connectors with HDPE outers can enable thinner landings and stair thicknesses, which means less concrete and less CO2. What’s more, since we’ve passed on cost savings for alternative raw materials and leaner manufacture, both our customers and the environment will benefit.
iC Managing Director, Derek Brown, commented:
“The show was a great opportunity for the iC brand to reach a truly international audience. We were taken aback by the volume, diversity and interest of visitors to our stand. Neighbouring European visitors are of course always expected, but we didn’t anticipate visitors from Peru, Chile, Nepal, Georgia, Iceland, Canada, Israel, Singapore, Ukraine and more. The positive reaction of customers in potential new markets was very gratifying. We look forward to following-up this interest and widening the reach of iC.”